On April 20, US-JOINT – an industry alliance led by Japan’s Resonac and backed by 12 Japanese and American materials and equipment leaders – officially started operations in Silicon Valley. This is the first U.S. alliance focused solely on advanced semiconductor packaging, targeting bottlenecks for AI and autonomous driving chips.

Based in Union City, California, the facility houses a complete advanced packaging line (patterning, bonding, molding, plating, high‑precision inspection) plus Class 100 and Class 1000 cleanrooms. Open to fabless design firms, wafer fabs, and alliance members.

Core pain point: traditional packaging validation takes about six months. US-JOINT cuts that to as short as one month – dramatically speeding time‑to‑market.

Full‑chain members include Azimuth Industrial, KLA, Kulicke & Soffa, MEC, Moses Lake Industries, Namics, Tokyo Ohka Kogyo, Toppan, TOWA, Ulvac, 3M, and Resonac. Japanese firms provide the tech backbone – Tokyo Ohka dominates global photoresist, TOWA holds over 70% of encapsulation equipment, Ulvac masters vacuum deposition. U.S. firms complement with inspection and advanced manufacturing.

Resonac (merged from Showa Denko and Hitachi Chemical) previously ran JOINT2 and JOINT3 alliances. Japan’s METI and executives from AMD, Broadcom support the alliance, calling it a global semiconductor innovation hub.

ICgoodFind : US-JOINT brings 12 leaders together to slash validation cycles and speed advanced packaging adoption. We track the packaging supply chain for you.